Why use cmp

Laser diffraction, dynamic light scattering, and small-angle X-ray scattering are the key techniques for delivering high accuracy and precision in this size range. Aggregation may cause oversize aggregates of up to 10 microns typically in the ppm range in numbers. Slurry stability against particle aggregation can be determined using zeta potential.

The presence of oversized particles can be detected using light scattering or imaging techniques. Malvern Panalytical has solutions and equipment to optimize various parameters of the CMP slurry used in the semiconductor industry:. Multi-technique nanoparticle characterization on a laboratory X-ray diffractometer.

Detecting over-sized particles in ink-jet inks using laser diffraction particle size analysis. Products Products.

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Contract services. Pharmaceutical services. Agrochemical services. The entire CMP process is completed in as few as 60 seconds, including a post-polish clean during which the wafer is washed, rinsed, and dried before exiting the CMP system. Service Solutions Supply Chain Solutions. Search form Search. Upgrade your browser for full experience You are using a web browser version that is no longer supported. Semiconductor Products Services.

View all Products. Moreover, we optimized our high purity alumina BRA product for tungsten W polishing. Indeed, it presents remarkable properties:. View related products. CMP — Chemical Mechanical Polishing Our need of high-performance devices keeps growing, requiring faster and faster systems, always more compact.

What is a CMP process? Properties of the process Experts recommend chemical mechanical planarazing for highly demanding semiconductor applications. Indeed, the process brings remarkable properties: High precision : the more data we achieve to store on a device, the more precise the design becomes. Storage devices are often produced by successive layers deposit. Those layers are very thin and must be fully flat with a perfect surface finish.